Advance Flexible OLEDs closer to mass market thanks to Universal Display and the Flexible display center.

The both companies introduced the first a-Si:H active matrix flexible organic light-emitting diode display to be manufactured directly on DuPont Teijin’s polyethylene naphthalate (PEN) substrate. Implementing Universal Display Corporation’s phosphorescent organic light-emitting diode (PHOLED) technology and materials and the FDC’s proprietary bond-debond manufacturing technology, the 4.1-inch monochrome quarter video graphics array (QVGA) display represents a significant milestone toward achieving a manufacturable solution for flexible OLEDs.

Flexible OLEDs are designed to target a number of military and commercial applications that require more rugged displays. With Universal Display’s PHOLED technology and materials, the new display achieves the same brightness as traditional displays with extremely low power consumption. Additional advantages of the technology include lower operating temperature due to less heat being generated, easier to drive, longer battery life, and more stable transistors.

“Being a founding member of the Flexible Display Center, Universal Display is pleased to see the significant progress enabled by our cooperation,” said Mike Hack, Vice President of Strategic Product Development at Universal Display. “Together, the FDC and Universal Display have demonstrated technology paths which will accelerate the introduction of exciting new flexible OLED displays on plastic substrates.”

“This development of flexible AMOLED technology gives the industry a solid starting point towards manufacturing, mass production and commercialization of flexible OLEDs,” said Shawn O’Rourke, director of engineering for the FDC. “The fact that we have achieved a functional flexible OLED manufactured directly on plastic using the Center’s manufacturing process represents a significant achievement, and continued developments over the next few years will lead to full color, full motion video flexible displays.”

The flexible backplane display was manufactured at the Flexible Display Center utilizing a 180°C thin film transistor process. The FDC’s facility implements traditional flat panel and semiconductor tools and processes to achieve flexible displays, enabled by its proprietary bond-debond technology to secure the plastic substrate to a rigid carrier during manufacture.

The FDC and Universal Display will present a paper discussing the active matrix flexible OLED on Friday, June 5th, in session 65.4 at SID 2009. Additionally, the FDC will demonstrate this device and other flexible display technologies in booth #523 at the show. Universal Display, located at booth #676 at the show, and DuPont Teijin are members of the Flexible Display Center.
Press release