GE has demonstrated an ultra high barrier thin-film encapsulation process on a wide variety of OLED structures through a batchmode, plasma-enhanced chemical vapor deposition process, which solves a critical need in the display industry for high-performance, hermetic packaging and is meant to allow lightweight, flexible rugged flat panel devices to be manufactured by a low cost, high throughput process such as roll-to-roll manufacturing.
Several companies in the flexible and printed electronics industry performed the encapsulation studies on OLEDs.

The goals of the program, which is a collaborative effort of private industry and the US Army Research Laboratory, located in Adelphi, MD, included the ability to demonstrate flexibility and achieve luminescence-current-voltage (LIV) characteristics, as well as shelf and operational life performance comparable to glass and metal encapsulated OLEDs, USDC said.

Source:edn.com