A company named 3D Micromac AG announced innovative production Solutions for Processing of OLEDs.
Highest throughput and efficient material utilization by using of ultra short pulsed laser
Organic light emitting diodes are electronic devices with a total thickness of a few millimeters sending out light. OLEDs are composed of different organic semiconductor thin film layers.
During the manufacturing process of an OLED the different thin film layers needs to be structured. Up to now mechanical or wet chemical technologies were used. A new and innovative solution for structuring these thin films is selective laser structuring.
3D-Micromac AG has developed and successful introduced a state of the art manufacturing concept for this laser structuring process into the market. Based on the microSTRUCT workstations a laser system was developed in the mayor field for selective structuring application of anode layers. Hereby the nearly transparent semiconductor tin-doped indium oxide (ITO) is used as anode material.
The integration of an ultra short pulsed laser in microSTRUCT guarantees a gentle structuring of anode without material damage at substrate level. Special highlight is the processing of variable and scalable substrate sizes. It is realized by an innovative software controlled scanner machining concept achieving a structuring speed of up to 1 meter per second.
In addition further layers of OLED can be machined with the same laser system. For instance there is a possibility to repair short circuits and remove other defects in the layer system of the OLED.
Furthermore the laser system can be used for engraving of the glass substrate. Marking can be done at the surface of the substrate and also as intra glass marking. The nearly athermal laser machining allows a micro marking of glass without micro cracks in the substrate.
A special feature of the laser workstation is an automatic handling system for reliable transportation of the OLED glass panels within the manufacturing process. A microscope system for inspection of the machined substrates – also equipped with an automatic handling – can also be added.
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