Corning Inc. said that it is to developed a process to bond high-quality silicon wafers onto glass, providing substrates which will be useful for growing electronic circuits, and appropriate for special semiconductor, display and imaging applications.

Corning specified that its SiOG technology is expected to enable high image resolution, full-motion video and low-power consumption for small- to medium-sized mobile display devices. This transpiring technology known as silicon on glass, or SiOG, will be used for Soitec and Corning substrates development. Soitec and Corning said they intend to tackle key challenges to broad commercialization of the high-quality, cost-effective displays promised by mobile OLED technology, including backplane electron mobility and uniformity as well as lower total system cost.And the main foucus is to be placed on top performance substrate technology for OLED mobile displays.